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The new packaging plant in Indiana will be focused on stacking dynamic random access memory (DRAM) chips to create high-end bandwidth memory (HBM), used to train AI, according to the Financial Times.
SK hynix said that nothing has been decided about location, although it is considering building a shop in the U.S.
“We keep exploring possible locations but haven’t decided yet,” a spokesperson at SK hynix said.
BY PARK EUN-JEE [park.eunjee@joongang.co.kr]